PCF2113DUSLASH2SLASHF4 datasheet(59/65 Pages) NXP

59 / 65 page

PCF2113_FAM_4

Product data sheet

Rev. 04 — 4 March 2008

59 of 65

NXP Semiconductors

PCF2113x

LCD controllers/drivers

The orientation of the IC in a pocket is indicated by the position of the IC type name on the

die surface with respect to the chamfer on the upper left corner of the tray. Refer to the

bonding pad location diagram (Figure 3) for the orientation and position of the type name

on the die surface.

20. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note

AN10365 “Surface mount reﬂow

soldering description”.

20.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

20.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Fig 41. Tray alignment

mgu207

PCF2113x

PCF2113DU/2/F4 数据表(PDF) 59 Page - NXP Semiconductors

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