PCF2113DUSLASH2SLASHF4 datasheet(60/65 Pages) NXP

60 / 65 page

PCF2113_FAM_4

Product data sheet

Rev. 04 — 4 March 2008

60 of 65

NXP Semiconductors

PCF2113x

LCD controllers/drivers

Key characteristics in both wave and reﬂow soldering are:

• Board speciﬁcations, including the board ﬁnish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

20.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

20.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 42) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 29 and 30

Table 29.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm)

Package reﬂow temperature (

°C)

Volume (mm3)

< 350

≥ 350

< 2.5

235

220

≥ 2.5

220

PCF2113DU/2/F4 数据表(PDF) 60 Page - NXP Semiconductors

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