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IMX28CEC 数据表(PDF) 32 Page - Freescale Semiconductor, Inc |
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IMX28CEC 数据表(HTML) 32 Page - Freescale Semiconductor, Inc |
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32 / 70 page ![]() i.MX28 Applications Processors Data Sheet for Consumer Products, Rev. 1 32 Freescale Semiconductor 3.5.3.2 DDR Output AC Timing Figure 6 and Table 36 show the DDR output AC timing defined for all DDR types: LPDDR1, standard DDR2 (1.8 V), and LVDDR2 (1.5 V) Figure 6. DDR Output AC Timing DDR3 CK low level width tCL 0.5 tCK –0.5 0.5 tCK + 0.5 ns DDR4 Address and control output setup time tIS 0.5 tCK – 1 0.5 tCK + 0.5 ns DDR5 Address and control output hold time tIH 0.5 tCK – 1 0.5 tCK + 0.5 ns Table 36. DDR Output AC Timing ID Description Symbol Min Max Unit DDR10 Positive DQS latching edge to associated CK edge tDQSS –0.5 0.5 ns DDR11 DQS falling edge from CK rising edge—hold time tDSH 0.5 tCK –0.5 0.5 tCK + 0.5 ns DDR12 DQS falling edge to CK rising edge—setup time tDSS 0.5 tCK –0.5 0.5 tCK + 0.5 ns Table 35. EMI Command/Address AC Timing (continued) ID Description Symbol Min. Max. Unit EMI_CLK EMI_CLKN EMI_DQS DDR13 DDR14 d0 DDR10 d1 d2 d3 EMI_DQ & EMI_DQM DDR11 DDR12 DDR15 DDR16 EMI_DQSN |
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