IMX28CEC datasheet(19/70 Pages) FREESCALE

19 / 70 page

i.MX28 Applications Processors Data Sheet for Consumer Products, Rev. 1

Freescale Semiconductor

3.2

Thermal Characteristics

The thermal resistance characteristics for the device are given in Table 22. These values are measured

under the following conditions:

•

Two layer Substrate

•

Substrate solder mask thickness: 0.025 mm

•

Substrate metal thicknesses: 0.016 mm

•

Substrate core thickness: 0.160 mm

•

Core via I.D: 0.068 mm, Core via plating 0.016 mm

•

Flag: trace style with ground balls under the die connected to the flag

•

Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K

•

Mold Compound: generic mold compound, k = 0.9 W/m K

3.3

I/O DC Parameters

This section includes the DC parameters of the following I/O types:

•

DDR I/O: Mobile DDR (LPDDR1), standard 1.8 V DDR2, and low-voltage 1.5 V DDR2

(LVDDR2)

•

General purpose I/O (GPIO)

Table 22. Thermal Resistance Data

Rating

Value

Unit

Junction to ambient1 natural convection

1 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-2 and JESD51-6. Thermal test board meets

JEDEC specification for this package.

Single layer board

(1s)

RθJA

°C/W

Junction to ambient1 natural convection

Four layer board (2s2p)

RθJA

°C/W

Junction to ambient1 (@200 ft/min)

Single layer board

(1s)

RθJMA

°C/W

Junction to ambient1 (@200 ft/min)

Four layer board

(2s2p)

RθJMA

°C/W

Junction to boards2

2 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification

for the specified package.

RθJB

°C/W

Junction to case (top)3

3 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is

used for the case temperature. Reported value includes the thermal resistance of the interface layer.

RθJCtop

°C/W

Junction to package top4

4 Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

Natural Convection

3°C/W

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