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DAC5687MPZPEP 数据表(PDF) 6 Page - Texas Instruments |
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DAC5687MPZPEP 数据表(HTML) 6 Page - Texas Instruments |
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6 / 75 page ![]() www.ti.com THERMAL CHARACTERISTICS (1) 1 10 100 1000 10000 90 100 110 120 130 140 150 160 Electromigration Fail Mode Wirebond Voiding Fail Mode Continuous TJ − 5C DAC5687-EP SGLS333 – JUNE 2006 over operating free-air temperature range (unless otherwise noted) Thermal Conductivity 100 HTQFP UNIT Theta junction-to-ambient (still air) 19.88 °C/W θ JA Theta junction-to-ambient (150 lfm) 14.37 °C/W θ JC Theta junction-to-case 3.11 °C/W (1) Air flow or heat sinking reduces θ JA and is highly recommended. Figure 1. DAC5687MPZPEP Operating Life Derating Chart 6 Submit Documentation Feedback |
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