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SPEAR1340 数据表(PDF) 191 Page - STMicroelectronics |
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SPEAR1340 数据表(HTML) 191 Page - STMicroelectronics |
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191 / 200 page ![]() SPEAr1340 Package information Doc ID 023063 Rev 4 191/200 Figure 52. PGBA package - bottom view Table 107. PGBA (23 x 23 mm, 0.8 mm pitch) package thermal characteristics Symbol Parameter Value Unit Θ JA (1) 1. Measured on JESD51 2s2p test board. Thermal resistance junction-to-ambient 16.5 °C/W Θ JB Thermal resistance junction-to-board 9 Θ JC Thermal resistance junction-to-case 5 Ψ JC Junction-to-case thermal characterisation parameter 0.23 |
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