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APFCON 数据表(PDF) 24 Page - Microchip Technology |
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APFCON 数据表(HTML) 24 Page - Microchip Technology |
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24 / 222 page ![]() MCP19111 DS22331A-page 24 2013 Microchip Technology Inc. Oscillator Internal Oscillator Frequency FOSC 7.60 8.00 8.40 MHz Switching Frequency FSW —FOSC/N — kHz Switching Frequency Range Select N 5 — 80 Maximum Duty Cycle — (N–1)/N — %/ 100 Dead Time Adjustment Dead Time Step Size DTSTEP —4 — ns HDRV Output Driver HDRV Source Resistance RHDRV-SCR —1 2.6 Measured at 500 mA Note 1, High Range —2 3.5 Measured at 500 mA Note 1, Low Range HDRV Sink Resistance RHDRV-SINK —1 2.6 Measured at 500 mA Note 1, High Range —2 3.5 Measured at 500 mA Note 1, Low Range HDRV Source Current IHDRV-SCR —2 — A Note 1, High Range —1 — A Note 1, Low Range HDRV Sink Current IHDRV-SINK —2 — A Note 1, High Range —1 — A Note 1, Low Range HDRV Rise Time tRH —15 30 ns Note 1, CLOAD =3.3 nF, High Range HDRV Fall Time tFH —15 30 ns Note 1, CLOAD =3.3 nF, High Range LDRV Output Driver LDRV Source Resistance RLDRV-SCR —1 2.5 Measured at 500 mA Note 1 LDRV Sink Resistance RLDRV-SINK —0.5 1.0 Measured at 500 mA Note 1 LDRV Source Current ILDRV-SCR —2 — A Note 1 LDRV Sink Current ILDRV-SINK —4 — A Note 1 LDRV Rise Time tRL —15 30 ns Note 1, CLOAD =3.3 nF LDRV Fall Time tFL —7 15 ns Note 1, CLOAD =3.3 nF 4.2 Electrical Characteristics (Continued) Electrical Specifications: Unless otherwise noted, VIN = 12V, VREF = 1.2V, FSW =300 kHz, TA =+25°C. Boldface specifications apply over the TA range of -40°C to +125°C. Parameter Symbol Min Typ Max Units Conditions Note 1: Ensured by design. Not production tested. 2: VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage. 3: This is the total source current for all GPIO pins combined. Individually, each pin can source a maximum of 25 mA. 4: PE1 = 0x00h, ABECON = 0x00h, ATSTCON = 0x80h, WPUGPA = 0x00h, WPUGPB = 0x00h, and SLEEP command issued to PIC core, see SECTION 16.0. |
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