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LSM330DLC 数据表(PDF) 64 Page - STMicroelectronics |
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LSM330DLC 数据表(HTML) 64 Page - STMicroelectronics |
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64 / 66 page ![]() Package information LSM330DLC 64/66 Doc ID 022162 Rev 2 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 23. LGA-28 (4x5x1.1 mm): mechanical data and package dimensions Dimensions Ref. mm Min. Typ. Max. A1 1.1 A2 0.855 A3 0.200 D1 3.850 4.000 4.150 E1 4.850 5.000 5.150 L1 3.75 L2 2.75 N1 0.500 M0.075 P1 2.200 P2 1.700 T1 0.265 0.325 0.385 T2 0.19 0.250 0.310 d0.200 k0.050 h0.100 LGA-28 (4x5x1.1mm) Land Grid Array Package Outline and 8181393A mechanical data |
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