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LSM330DLC 数据表(PDF) 31 Page - STMicroelectronics |
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LSM330DLC 数据表(HTML) 31 Page - STMicroelectronics |
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31 / 66 page ![]() LSM330DLC Application hints Doc ID 022162 Rev 2 31/66 5.2 Soldering information The LGA package is compliant with ECOPACK®, RoHS and “Green” standards. It is qualified for soldering heat resistance according to JEDEC J-STD-020D. Leave “Pin 1 Indicator” unconnected during soldering. Land pattern and soldering recommendations are available at www.st.com/mems. |
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