Data Sheet

ADP5063

Rev. 0 | Page 43 of 44

PACKAGING AND ORDERING INFORMATION

OUTLINE DIMENSIONS

Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-20-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

Temperature Range (Junction)

Package Description

Package Option

ADP5063ACPZ-1-R7

–40°C to +125°C

20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-20-8

ADP5063CP-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

2

For additional factory-programmable options, contact an Analog Devices, Inc., local sales or distribution representative

.

0.50

BSC

0.50

0.40

0.30

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.75

2.60 SQ

2.35

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

1

20

6

10

11

15

16

5