MPC8347ECVRADDB datasheet(84/99 Pages) FREESCALE

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MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12

Freescale Semiconductor

Thermal

20 Thermal

This section describes the thermal specifications of the MPC8347EA.

20.1

Thermal Characteristics

Table 65 provides the package thermal characteristics for the 672 35

× 35 mm TBGA of the MPC8347EA.

306

0011

0000110

—

200

600

405

0100

0000101

—

266

667

504

0101

0000100

—

333

667

1 The PLL configuration reference number is the hexadecimal representation of RCWL, bits 4–15 associated with the SPMF and

COREPLL settings given in the table.

2 The input clock is CLKIN for PCI host mode or PCI_CLK for PCI agent mode.

Table 65. Package Thermal Characteristics for TBGA

Characteristic

Symbol

Value

Unit

Notes

Junction-to-ambient natural convection on single-layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient natural convection on four-layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-ambient (at 200 ft/min) on single-layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-ambient (at 2 m/s) on single-layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (at 2 m/s) on four-layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-board thermal

RθJB

3.8

°C/W

Junction-to-case thermal

RθJC

1.7

°C/W

Table 64. Suggested PLL Configurations (continued)

Ref

No.1

RCWL

400 MHz Device

533 MHz Device

667 MHz Device

SPMF

CORE

PLL

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

Input

Clock

Freq

(MHz)2

CSB

Freq

(MHz)

Core

Freq

(MHz)

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