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A25LS512A 数据表(PDF) 10 Page - AMIC Technology

部件名 A25LS512A
功能描述  512Kbit Low Voltage, Serial Flash Memory
PDF  43 Pages
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制造商  AMICC [AMIC Technology]
网页  http://www.amictechnology.com
标志 AMICC - AMIC Technology

A25LS512A 数据表(HTML) 10 Page - AMIC Technology

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A25LS512A Series
(November, 2014, Version 1.1)
9
AMIC Technology Corp.
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of
the device, most significant bit first.
Serial Data Input (DIO) is sampled on the first rising edge of
Serial Clock (C) after Chip Select (
S ) is driven Low. Then, the
one-byte instruction code must be shifted in to the device,
most significant bit first, on Serial Data Input (DIO), each bit
being latched on the rising edges of Serial Clock (C).
The instruction set is listed in Table 3.
Every instruction sequence starts with a one-byte instruction
code. Depending on the instruction, this might be followed by
address bytes, or by data bytes, or by both or none.
In the case of a Read Data Bytes (READ), Read Data Bytes at
Higher Speed (Fast_Read), Read Status Register (RDSR) or
Release from Deep Power-down, Read Device Identification
and Read Electronic Signature (RES) instruction, the shifted-in
instruction sequence is followed by a data-out sequence. Chip
Select (
S ) can be driven High after any bit of the data-out
sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Block
Erase (BE), Chip Erase (CE), Write Status Register (WRSR),
Write Enable (WREN), Write Disable (WRDI) or Deep
Power-down (DP) instruction, Chip Select (
S ) must be driven
High exactly at a byte boundary, otherwise the instruction is
rejected, and is not executed. That is, Chip Select (
S ) must
driven High when the number of clock pulses after Chip Select
(
S ) being driven Low is an exact multiple of eight.
All attempts to access the memory array during a Write Status
Register cycle, Program cycle or Erase cycle are ignored, and
the internal Write Status Register cycle, Program cycle or
Erase cycle continues unaffected.
Table 3. Instruction Set
Instruction
Description
One-byte
Instruction Code
Address
Bytes
Dummy
Bytes
Data
Bytes
WREN
Write Enable
0000 0110
06h
0
0
0
WRDI
Write Disable
0000 0100
04h
0
0
0
RDSR
Read Status Register
0000 0101
05h
0
0
1 to ∞
WRSR
Write Status Register
0000 0001
01h
0
0
1
READ
Read Data Bytes
0000 0011
03h
3
0
1 to ∞
FAST_READ
Read Data Bytes at Higher Speed
0000 1011
0Bh
3
1
1 to ∞
FAST_READ_DUAL
_OUTPUT
Read Data Bytes at Higher Speed by
Dual Output
(1)
00111011
3Bh
3
1
1 to ∞
FAST_READ_DUAL
_INPUT-OUTPUT
Read Data Bytes at Higher Speed by
Dual Input and Dual Output
(1)
10111011
BBh
3
(2)
1
(2)
1 to ∞
PP
Page Program
0000 0010
02h
3
0
1 to 256
SE
Sector Erase
0010 0000
20h
3
0
0
BE
Block Erase
1101 1000
D8h
3
0
0
CE
Chip Erase
1100 0111
C7h
0
0
0
DP
Deep Power-down
1011 1001
B9h
0
0
0
RDID
Read Device Identification
1001 1111
9Fh
0
0
1 to ∞
REMS
Read Electronic Manufacturer & Device
Identification
1001 0000
90h
1
(3)
2
1 to ∞
Release from Deep Power-down, and
Read Electronic Signature
0
3
1 to ∞
RES
Release from Deep Power-down
1010 1011
ABh
0
0
0
Note: (1) DIO = (D6, D4, D2, D0)
DO = (D7, D5, D3, D1)
(2) Dual Input, DIO = (A22, A20, A18, ………, A6, A4, A2, A0)
DO = (A23, A21, A19, …….., A7, A5, A3, A1)
(3) ADD= (00h) will output manufacturer’s ID first and ADD=(01h) will output device ID first



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