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USB3503 数据表(PDF) 57 Page - Microchip Technology |
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USB3503 数据表(HTML) 57 Page - Microchip Technology |
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57 / 73 page ![]() 2011-2015 Microchip Technology Inc. DS00001584B-page 57 USB3503 In addition to defining the ESD tests, EN 61000-4-2 also categorizes the impact to equipment operation when the strike occurs (ESD Result Classification). Both air discharge and contact discharge test techniques for applying stress condi- tions are defined by the EN 61000-4-2 ESD document. 10.10.3 AIR DISCHARGE To perform this test, a charged electrode is moved close to the system being tested until a spark is generated. This test is difficult to reproduce because the discharge is influenced by such factors as humidity, the speed of approach of the electrode, and construction of the test equipment. 10.10.4 CONTACT DISCHARGE The uncharged electrode first contacts the pin to prepare this test, and then the probe tip is energized. This yields more repeatable results, and is the preferred test method. The independent test laboratories contracted by Microchip provide test results for both types of discharge methods. 10.11 AC Specifications 10.11.1 REFCLK External Clock:50% duty cycle ± 10%, ± 350ppm, Jitter < 100ps rms. 10.11.2 SERIAL INTERFACE The Hub conforms to AC specifications as set forth in the I2C Specification for Slave-Only devices. 10.11.3 USB 2.0 The Hub conforms to all voltage, power, and timing characteristics and specifications as set forth in the USB 2.0 Spec- ification. Please refer to the USB 2.0 Specification which is available from the www.usb.org web site. 10.11.4 USB 2.0 HSIC The upstream port of the HSIC Hub conforms to all voltage, power, and timing characteristics and specifications as set forth in the High-Speed Inter-Chip USB Electrical Specification Version 1.0. Please refer to the USB 2.0 HSIC Specifi- cation which is available from the www.usb.org web site. |
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