MCP23017-ESLASHML datasheet(26/42 Pages) MICROCHIP

26 / 42 page

MCP23017/MCP23S17

DS20001952C-page 26

 2005-2016 Microchip Technology Inc.

4.0

PACKAGING INFORMATION

4.1

Package Marking Information

MCP23017-E/SO

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

28-Lead SOIC

Example:

28-Lead SSOP

YYWWNNN

XXXXXXXXXXXX

Example:

28-Lead QFN

Example:

28-Lead SPDIP

Example:

XXXXXXXXXXXXXXXXX

YYWWNN

MCP23017-E/SP

1628256

MCP23017

E/SS 3

1628256

23017

E/ML

1628256

MCP23017-E/ML 数据表(PDF) 26 Page - Microchip Technology

MCP23017-E/ML 数据表(HTML) 26 Page - Microchip Technology

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MCP23017-E/ML 数据表(PDF) 26 Page - Microchip Technology

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