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STM8AF6213 数据表(PDF) 98 Page - STMicroelectronics

部件名 STM8AF6213
功能描述  Automotive 8-bit MCU, with up to 8 Kbyte Flash, data EEPROM, 10-bit ADC, timers, LIN, SPI, IC, 3 to 5.5 V
PDF  106 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM8AF6213 数据表(HTML) 98 Page - STMicroelectronics

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STM8AF6213/23/23A/26
98/106
DocID025118 Rev 5
10.3
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 26: General operating conditions
.
TJmax, in degrees Celsius, may be calculated using the following equation:
TJmax = TAmax + (PDmax x JA)
Where:
–TAmax is the maximum ambient temperature in C
JA is the package junction-to-ambient thermal resistance in C/W
–PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
–PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum
chip internal power.
–PI/Omax represents the maximum power dissipation on output pins
Where:
PI/Omax = (VOL*IOL) + ((VDD-VOH)*IOH), 
taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level
in the application.
10.3.1
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
10.3.2
Selecting the product temperature range
When ordering the microcontroller, the temperature range is specified in the order code (see
Section 11: Ordering information
).
The following example shows how to calculate the temperature range needed for a given
application.
Table 63. Thermal characteristics(1)
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol
Parameter
Value
Unit
JA
Thermal resistance junction-ambient
TSSOP20 - 4 x 4 mm
110
°C/W
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
60
°C/W



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