USB84604 datasheet(42/61 Pages) MICROCHIP

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USB84604

DS60001295C-page 42

 2014-2016 Microchip Technology Inc.

9.3

Package Thermal Specifications

The following thermal parameters are valid for ePAD = 5.1 x 5.1 mm.

9.4

Power Consumption

This section details the power consumption of the device as measured during various modes of operation. Power dis-

sipation is determined by temperature, supply voltage, and external source/sink requirements.

9.4.1

OPERATIONAL / UNCONFIGURED

9.4.1.1

HSIC Upstream

TABLE 9-1:

PACKAGE THERMAL PARAMETERS

Parameter

Symbol

°C/W

Velocity (meters/s)

Thermal Resistance Junction to Ambient

JA

Thermal Resistance Junction to Ambient

JA

Thermal Resistance Junction to Top of Case

JC

3.4

Thermal Resistance Junction to Board

JB

Thermal Resistance Junction to Bottom of Case

JT

0.2

Thermal Resistance Junction to Bottom of Case

JT

0.4

TABLE 9-2:

OPERATIONAL/UNCONFIGURED POWER CONSUMPTION (HSIC UPSTREAM)

Typical (mA)

Maximum (mA)

VBAT

VDDCOREREG

(Note 8)

VBAT

VDDCOREREG

(Note 8)

HS Host / 1 HS Device

HS Host / 2 HS Devices

HS Host / 4 HS Devices

100

HS Host / 1 FS Device

HS Host / 2 FS Devices

HS Host / 4 FS Devices

Unconfigured

Note 8: Includes VDD12 current.

Note:

The regulators are on. Refer to diagram Dual Supply Application in Figure 4-1 Power Connections on page

22.

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