USB84604 datasheet(54/61 Pages) MICROCHIP

54 / 61 page

USB84604

DS60001295C-page 54

 2014-2016 Microchip Technology Inc.

FIGURE 10-1:

USB84604 48-PIN QFN PACKAGE DRAWING

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

5.20

MILLIMETERS

0.50 BSC

MIN

MAX

6.90

Contact Pad Length (X48)

Contact Pad Width (X48)

0.85

0.30

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M

Microchip Technology Drawing C04-2363A

NOM

SILK SCREEN

Contact Pad Spacing

6.90

Contact Pad to Center Pad (X44)

0.20

Thermal Via Diameter

Thermal Via Pitch

0.33

1.20

ØV

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

48-Lead Plastic Quad Flat, No Lead Package (5E) - 7x7 mm Body [QFN]

With 5.1x5.1 mm Exposed Pad; Punch Singulated, 0.40 mm Dimpled Terminals

USB84604 数据表(PDF) 54 Page - Microchip Technology

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