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FT120T-R 数据表(PDF) 35 Page - Future Technology Devices International Ltd. |
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FT120T-R 数据表(HTML) 35 Page - Future Technology Devices International Ltd. |
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35 / 40 page ![]() Copyright © 2014 Future Technology Devices International Limited 35 Document No.: FT_000646 FT120 USB DEVICE CONTROLLER WITH PARALLEL BUS IC Datasheet Version 1.2 Clearance No.: FTDI# 291 9.5 Solder Reflow Profile The FT120 is supplied in Pb free TSSOP-28 and QFN-28 packages. The recommended solder reflow profile for both package options is shown in Figure 9-5. Figure 9-5 FT120 Solder Reflow Profile The recommended values for the solder reflow profile are detailed in Table 9-1. Values are shown for both a completely Pb free solder process (i.e. the FT120 is used with Pb free solder), and for a non-Pb free solder process (i.e. the FT120 is used with non-Pb free solder). Profile Feature Pb Free Solder Process Non-Pb Free Solder Process Average Ramp Up Rate (Ts to Tp) 3°C / second Max. 3°C / Second Max. Preheat - Temperature Min (Ts Min.) - Temperature Max (Ts Max.) - Time (ts Min to ts Max) 150°C 200°C 60 to 120 seconds 100°C 150°C 60 to 120 seconds Time Maintained Above Critical Temperature TL: - Temperature (TL) - Time (tL) 217°C 60 to 150 seconds 183°C 60 to 150 seconds Peak Temperature (Tp) 260°C 240°C Critical Zone: when T is in the range T to T Time, t (seconds) 25 P T = 25º C to T tp Tp TL t Preheat S t L Ramp Up L p Ramp Down T Max S T Min S |
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