FT221XS-R datasheet(38/45 Pages) FTDI

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FT221XS-R 数据表(PDF) 38 Page - Future Technology Devices International Ltd.

部件名	FT221XS-R

功能描述	Future Technology Devices International Ltd.

PDF	45 Pages

Scroll/Zoom	100%

制造商	FTDI [Future Technology Devices International Ltd.]

网页	http://www.ftdichip.com

标志

38 / 45 page

FT221X USB 8-BIT SPI/FT1248 IC Datasheet

Version 1.3

Document No.: FT_000630 Clearance No.: FTDI# 263

10.3 QFN-20 Package Mechanical Dimensions

Figure 10.3 QFN-20 Package Dimensions

The FT221XQ is supplied in a RoHS compliant leadless QFN-20 package. The package is lead (Pb) free,

and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.

This package is nominally 4.00mm x 4.00mm. The solder pads are on a 0.50mm pitch. The above

mechanical drawing shows the QFN-32 package. All dimensions are in millimetres.

The centre pad on the base of the FT221XQ is internally connected to GND, and the PCB should not have

signal tracks on the top layer under this device.

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