FT313HQ-R datasheet(57/67 Pages) FTDI

部件名	FT313HQ-R

功能描述	USB2.0 HS Embedded Host Controller

PDF	67 Pages

Scroll/Zoom	100%

制造商	FTDI [Future Technology Devices International Ltd.]

网页	http://www.ftdichip.com

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57 / 67 page

Document No.: FT_000589

FT313H USB2.0 HS Host Controller Datasheet Version 1.2

Clearance No.: FTDI# 318

8 Package Parameters

The FT313H is available in three different packages. The FT313HQ is the QFN-64 package, the FT313HL is

the LQFP-64 package and the FT313HP is the TQFP-64 package. The solder reflow profile for all packages

is described in following sections.

8.1 FT313H Package Markings

8.1.1 QFN-64

An example of the markings on the QFN package are shown in Figure 8-1. The FTDI part number is too

long for the 64 QFN package so in this case the last two digits are wrapped down onto the date code line.

Notes:

1. YYWW = Date Code, where YY is year and WW is week number

2. Marking alignment should be centre justified

3. Laser Marking should be used

FTDI

XXXXXXXXXX

FT313HQ

Line 1 – FTDI Logo

Line 4 – Date Code, Revision

Line 2 – Wafer Lot Number

Line 3 – FTDI Part Number

YYWW-B

Figure 8-1 QFN Package Markings

FT313HQ-R 数据表(PDF) 57 Page - Future Technology Devices International Ltd.