FT313HQ-R datasheet(63/67 Pages) FTDI

63 / 67 page

Document No.: FT_000589

FT313H USB2.0 HS Host Controller Datasheet Version 1.2

Clearance No.: FTDI# 318

8.5 Solder Reflow Profile

The FT313H is supplied in Pb free QFN-64, LQFP-64 and TQFP-64 packages. The recommended solder

reflow profile for all package options is shown in

The recommended values for the solder reflow profile are detailed in Table 8-1. Values are shown for

both a completely Pb free solder process (i.e. the FT313H is used with Pb free solder), and for a non-Pb

free solder process (i.e. the FT313H is used with non-Pb free solder).

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak Temperature

(tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 8-1 Reflow Profile Parameter Values

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

Figure 8-7 FT313H Solder Reflow Profile

FT313HQ-R 数据表(PDF) 63 Page - Future Technology Devices International Ltd.

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