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STM32F042F4 数据表(PDF) 96 Page - STMicroelectronics |
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STM32F042F4 数据表(HTML) 96 Page - STMicroelectronics |
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96 / 117 page ![]() Package information STM32F042x4 STM32F042x6 96/117 DocID025832 Rev 5 7.3 WLCSP36 package information WLCSP36 is a 36-ball, 2.605 x 2.703 mm, 0.4 mm pitch wafer-level chip-scale package. Figure 39. WLCSP36 package outline 1. Drawing is not to scale. Table 68. WLCSP36 package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.380 - - 0.0150 - A3(2) - 0.025 - - 0.0010 - b(3) 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 2.570 2.605 2.640 0.1012 0.1026 0.1039 E 2.668 2.703 2.738 0.1050 0.1064 0.1078 e - 0.400 - - 0.0157 - e1 - 2.000 - - 0.0787 - e2 - 2.000 - - 0.0787 - |
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