STM32F042F4 datasheet(47/117 Pages) STMICROELECTRONICS

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STM32F042x4 STM32F042x6

Electrical characteristics

6.3

Operating conditions

6.3.1

General operating conditions

6.3.2

Operating conditions at power-up / power-down

The parameters given in Table 22 are derived from tests performed under the ambient

temperature condition summarized in Table 21.

Table 21. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK

Internal APB clock frequency

VDD

Standard operating voltage

2.0

3.6

VDDIO2

I/O supply voltage

Must not be supplied if VDD

is not present

1.65

3.6

VDDA

Analog operating voltage

(ADC not used)

Must have a potential equal

to or higher than VDD

VDD

3.6

Analog operating voltage

(ADC used)

2.4

3.6

VBAT

Backup operating voltage

1.65

3.6

VIN

I/O input voltage

TC and RST I/O

-0.3

VDDIOx+0.3

TTa I/O

-0.3

VDDA+0.3(1)

FT and FTf I/O

-0.3

5.5(1)

Power dissipation at TA = 85 °C

for suffix 6 or TA = 105 °C for

suffix 7(2)

LQFP48

364

UFQFPN48

606

WLCSP36

313

LQFP32

351

UFQFPN32

526

UFQFPN28

170

TSSOP20

263

Ambient temperature for the

suffix 6 version

Maximum power dissipation

–40

°C

Low power dissipation(3)

–40

105

Ambient temperature for the

suffix 7 version

Maximum power dissipation

–40

105

°C

Low power dissipation(3)

–40

125

Junction temperature range

Suffix 6 version

–40

105

°C

Suffix 7 version

–40

125

1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled.

2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See Section 7.8: Thermal characteristics.

3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.8:

Thermal characteristicsSection 7.8: Thermal characteristics

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