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STM32F042F4 数据表(PDF) 97 Page - STMicroelectronics |
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STM32F042F4 数据表(HTML) 97 Page - STMicroelectronics |
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97 / 117 page  DocID025832 Rev 5 97/117 STM32F042x4 STM32F042x6 Package information 113 Figure 40. Recommended pad footprint for WLCSP36 package F - 0.3025 - - 0.0119 - G - 0.3515 - - 0.0138 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 69. WLCSP36 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed Table 68. WLCSP36 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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