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STM32F042F4 数据表(PDF) 101 Page - STMicroelectronics |
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STM32F042F4 数据表(HTML) 101 Page - STMicroelectronics |
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101 / 117 page  DocID025832 Rev 5 101/117 STM32F042x4 STM32F042x6 Package information 113 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 44. LQFP32 package marking example 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. 7.5 UFQFPN32 package information UFQFPN32 is a 32-pin, 5x5 mm, 0.5 mm pitch ultra-thin fine-pitch quad flat package. |
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