AD9268 datasheet(13/45 Pages) AD

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AD9268

Rev. A | Page 12 of 44

ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Table 6.

Parameter

Rating

ELECTRICAL1

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +2.0 V

VIN+A/VIN+B, VIN−A/VIN−B to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

SYNC to AGND

−0.3 V to AVDD + 0.2 V

VREF to AGND

−0.3 V to AVDD + 0.2 V

SENSE to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

RBIAS to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.2 V

SCLK/DFS to AGND

−0.3 V to DRVDD + 0.2 V

SDIO/DCS to AGND

−0.3 V to DRVDD + 0.2 V

OEB

−0.3 V to DRVDD + 0.2 V

PDWN

−0.3 V to DRVDD + 0.2 V

D0A/D0B through D15A/D15B to

AGND

−0.3 V to DRVDD + 0.2 V

DCOA/DCOB to AGND

−0.3 V to DRVDD + 0.2 V

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the PCB

increases the reliability of the solder joints and maximizes the

thermal capability of the package.

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown in Table 7, airflow improves heat dissipation,

which reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces θJA.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

θJA1,2

θJC1,3

θJB1,4

Unit

64-Lead LFCSP

(CP-64-6)

18.5

1.0

°C/W

1.0

16.1

9.2

°C/W

2.5

14.5

°C/W

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

ESD CAUTION

1 The inputs and outputs are rated to the supply voltage (AVDD or ARVDD) +

0.2 V but should not exceed 2.1 V.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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