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ADAU1361BCPZ-R7 数据表(PDF) 16 Page - Analog Devices |
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ADAU1361BCPZ-R7 数据表(HTML) 16 Page - Analog Devices |
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16 / 80 page  ADAU1361 Data Sheet Rev. D | Page 16 of 80 Pin No. Mnemonic Type1 Description 19 RHP A_OUT Right Headphone Output. Biased at AVDD/2. 20 LHP A_OUT Left Headphone Output. Biased at AVDD/2. 21 MONOOUT A_OUT Mono Output or Virtual Ground for Capless Headphone. Biased at AVDD/2 when set as mono output. 22 AGND PWR Analog Ground. The AGND and DGND pins can be tied together on a common ground plane. AGND should be decoupled locally to AVDD with a 100 nF capacitor. 23 AVDD PWR 1.8 V to 3.3 V Analog Supply for ADC, Output Driver, and Input to Digital Supply Regulator. This pin should be decoupled locally to AGND with a 100 nF capacitor. 24 DVDDOUT PWR Digital Core Supply Decoupling Point. The digital supply is generated from an on-board regulator and does not require an external supply. DVDDOUT should be decoupled to DGND with a 100 nF capacitor and a 10 μF capacitor. 25 DGND PWR Digital Ground. The AGND and DGND pins can be tied together on a common ground plane. DGND should be decoupled to DVDDOUT and to IOVDD with 100 nF capacitors and 10 μF capacitors. 26 ADC_SDATA D_OUT ADC Serial Output Data. 27 DAC_SDATA D_IN DAC Serial Input Data. 28 BCLK D_IO Serial Data Port Bit Clock. 29 LRCLK D_IO Serial Data Port Frame Clock. 30 ADDR1/CDATA D_IN I2C Address Bit 1 (ADDR1). SPI Data Input (CDATA). 31 SDA/COUT D_IO I2C Data (SDA). This pin is a bidirectional open-collector input/output. The line connected to this pin should have a 2 kΩ pull-up resistor. SPI Data Output (COUT). This pin is used for reading back registers and memory locations. It is three-state when an SPI read is not active. 32 SCL/CCLK D_IN I2C Clock (SCL). This pin is always an open-collector input when in I2C control mode. The line connected to this pin should have a 2 kΩ pull-up resistor. SPI Clock (CCLK). This pin can run continuously or be gated off between SPI transactions. EP Exposed Pad Exposed Pad. The exposed pad is connected internally to the ADAU1361 grounds. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the ground plane. See the Exposed Pad PCB Design section for more information. 1 A_IN = analog input, A_OUT = analog output, D_IN = digital input, D_IO = digital input/output, D_OUT = digital output, PWR = power. |
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