Figure 40.

Read command .................................................................. 23

Figure 41.

Capacitor placing ................................................................. 31

Figure 42.

Inductor placing .................................................................. 31

Figure 43.

RSNS Kelvin connection (sx sense in the same layer, at dx with vias top to bottom) ................... 32

Figure 44.

Thermal aspects .................................................................. 33

Figure 45.

QFN3x4x1.0 24L package outline ...................................................... 35

Figure 46.

QFN3x4x1.0 24L recommended footprint ................................................. 36

STPD01

List of figures

DS13473 - Rev 1

page 42/43