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LP3971 数据表(PDF) 11 Page - National Semiconductor (TI) |
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LP3971 数据表(HTML) 11 Page - National Semiconductor (TI) |
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11 / 42 page ![]() I 2C Compatible Serial Interface Electrical Specifications (SDA and SCL) Unless otherwise noted, V IN = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the entire junction temperature range for operation, −40˚C to +125˚C. (Notes 2, 6) and (Note 9) Symbol Parameter Conditions Min Typ Max Units V IL Low Level Input Voltage (Note 14) −0.5 0.3 V RTC V V IH High Level Input Voltage (Note 14) 0.7 V RTC V RTC V OL Low Level Output Voltage (Note 14) 0 0.2 V TRC I OL Low Level Output Current V OL = 0.4V (Note 14) 3.0 mA F CLK Clock Frequency (Note 14) 400 kHz t BF Bus-Free Time Between Start and Stop (Note 14) 1.3 µs t HOLD Hold Time Repeated Start Condition (Note 14) 0.6 µs t CLKLP CLK Low Period (Note 14) 1.3 µs t CLKHP CLK High Period (Note 14) 0.6 µs t SU Set Up Time Repeated Start Condition (Note 14) 0.6 µs t DATAHLD Data Hold Time (Note 14) 0 µs t CLKSU Data Set Up Time (Note 14) 100 ns T SU Set Up Time for Start Condition (Note 14) 0.6 µs T TRANS Maximum Pulse Width of Spikes that Must be Suppressed by the Input Filter of Both DATA & CLK Signals (Note 14) 50 ns Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125˚C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – ( θJA x PD-MAX). Note 4: Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51–7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/1.8 µm/18 µm/36 µm (1.5 oz/1 oz/1 oz/1.5 oz). Ambient temperature in simulation is 22˚C, still air. Power dissipation is 1W. Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. The value of θJA of this product can vary significantly, depending on PCB material, layout, and environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation issues. For more information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP) and the Power Efficiency and Power Dissipation section of this datasheet. Note 5: The Human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. (MIL-STD-883 3015.7). The machine model is a 200 pF capacitor discharged directly into each pin. (EAIJ) Note 6: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are production tested, guaranteed through statistical analysis or guaranteed by design. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 7: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. Note 8: Back-up battery charging current is programmable via the I2C compatible interface. Refer to the Application Section for more information. Note 9: The I2C signals behave like open-drain outputs and require an external pull-up resistor on the system module in the 2 k Ω to 20 kΩ range. Note 10: LDO_RTC voltage can track LDO1 (I/O) Voltage. Refer to LP3971 Controls Section for more information. Note 11: VIN minimum for line regulation values is 2.7V for LDOs 1–3 and 1.8V for LDOs 4 and 5. Condition does not apply to input voltages below the minimum input operating voltage. Note 12: The input voltage range recommended for ideal applications performance for the specified output voltages is given below: VIN = 2.7V to 5.5V for 0.80V < VOUT < 1.8V VIN =(VOUT+ 1V) to 5.5V for 1.8V ≤ VOUT ≤ 3.3V Note 13: Test condition: for VOUT less than 2.7V, VIN = 3.6V; for VOUT greater than or equal to 2.7V, VIN =VOUT+1V. Note 14: This electrical specification is guaranteed by design. Note 15: An increase in the load current results in a slight decrease in the output voltage and vice versa. Note 16: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. This specification does not apply for input voltages below 2.7V for LDOs 1–3 and 1.8V for LDOs 4 and 5. www.national.com 11 |
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