AT25DF256 datasheet(38/43 Pages) DIALOG

38 / 43 page

AT25DF256

DS-25DF256–035D–2/2017

16.

Ordering Information

16.1 Ordering Code Detail

16.2 Green Package Options (Pb/Halide-free/RoHS Compliant)

A T 2 5 D 2 5

S S H

6–

–

Designator

Product Family

Device Density

256 = 256-kilobit

Package Option

SS = 8-lead, 0.150" wide SOIC

MA = 8-pad, 2 x 3 x 0.6 mm UDFN

XM = 8-lead TSSOP

Device Grade

H = Green, NiPdAu lead finish, industrial

temperature range (-40°C to +85°C)

Shipping Carrier Option

B = Bulk (tubes)

T = Tape and reel

Voltage Code

N = 1.65V to 3.6V

Ordering Code (1)

Package

Lead Finish

Operating Voltage

Max. Freq.

(MHz)

Operation Range

AT25DF256-SSHN-B

AT25DF256-SSHN-T

8S1

NiPdAu

1.65V to 3.6V (2)

104

Industrial

(-40°C to +85°C)(2)

AT25DF256-MAHN-T

8MA3

AT25DF256-XMHN-B

AT25DF256-XMHN-T

1. The shipping carrier option code is not marked on the devices.

2. Temperature Range:-10°C to +85°C (1.65V to 3.6V), -40°C to +85° (1.7V to 3.6V).

Package Type

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)

8MA3

8-pad, 2 x 3 x 0.6 mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN)

8-lead, Thin Small Outline Package

AT25DF256 数据表(PDF) 38 Page - Dialog Semiconductor

AT25DF256 数据表(HTML) 38 Page - Dialog Semiconductor

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

数据表下载