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ASL5015FHN 数据表(PDF) 69 Page - NXP Semiconductors |
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ASL5015FHN 数据表(HTML) 69 Page - NXP Semiconductors |
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69 / 69 page  NXP Semiconductors ASL5xxxyHz Matrix LED Controller (MLC) Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2019. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 February 2019 Contents 1 General description ............................................ 1 2 Features ............................................................... 3 3 Applications .........................................................3 4 Orderable parts ................................................... 4 5 Application diagram ............................................5 6 Block diagram ..................................................... 6 7 Pinning information ............................................ 7 7.1 Pinning – HVQFN36 package ........................... 7 7.2 Pin description – HVQFN36 package ................ 7 7.3 Pinning – HLQFP48 package ............................9 7.4 Pin description – HLQFP48 package .................9 8 Functional description ......................................11 8.1 Integrated switches for single or multiple LEDs dimming ................................................. 11 8.2 LED current capability and power dissipation ...13 8.3 Internal PWM dimming generator and phase shifting ..............................................................13 8.4 Programming and execution of PWM dimming – ASL50xxyHz .................................. 15 8.4.1 Channel programming registers map ...............17 8.5 Delay coefficient – ASL50xxyHz ......................20 8.6 Diagnostics ...................................................... 20 8.6.1 Direct NTC input ..............................................20 8.6.2 Direct Identification resistor input .....................21 8.6.3 LED fault detection .......................................... 21 8.6.4 Internal junction temperature warnings ............22 8.6.5 Undervoltage detection and protection ............ 22 8.6.6 Diagnosis registers map .................................. 22 8.6.6.1 Register 34h - Status register ..........................22 8.6.6.2 Read diagnostic bits, from MLC to microcontroller ................................................. 24 8.7 Internal oscillator 200 MHz for digital blocks .... 26 8.8 Charge Pump .................................................. 27 8.9 Charge pump fail-safe operation mode (CPFSO) .......................................................... 27 8.10 Matrix LED controller interface and configuration .................................................... 28 8.11 External IC addressing .................................... 29 8.12 Protection against missing VCC ...................... 29 8.13 LED brightness calibration factor .....................29 8.14 Limp Home mode operation ............................ 30 8.14.1 Limp Home mode activation ............................31 8.14.2 Limp Home mode operation ............................ 31 8.14.3 Limp Home mode deactivation ........................ 31 8.15 Communication interface ................................. 32 8.16 Application protocol ......................................... 33 9 CAN commands ................................................ 34 10 ASL50xxyHz Register map ...............................38 11 Direct PWM mode – ASL51xxyHz. ...................40 11.1 ASL51xxSHy Register MAP ............................ 40 12 Sleep and Wake Up .......................................... 41 13 Partial networking for Sleep and Wake Up (message based) ...............................................42 13.1 CAN message configuration for Partial_ Sleep and Partial_Wake .................................. 43 14 Nonvolatile Multitime Programmable Memory (MTP) ................................................... 43 14.1 MTP memory map ...........................................44 14.1.1 Registers value selection criteria .....................46 15 Limiting values ..................................................49 16 Thermal characteristics ....................................51 17 Static characteristics ........................................51 18 Dynamic characteristics ...................................53 19 Packaging .......................................................... 54 19.1 Package mechanical dimensions .................... 54 20 Revision history ................................................ 65 21 Legal information ..............................................66 |
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