ADP5043ACPZ-1-R7 datasheet(30/30 Pages) AD

30 / 30 page

ADP5043

Data Sheet

Rev. C | Page 30 of 30

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.25

0.18

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD-11.

4.10

4.00 SQ

3.90

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

2.75

2.60 SQ

2.35

BOTTOM VIEW

TOP VIEW

SIDE VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

EXPOSED

PAD

SEATING

PLANE

P IN 1

IN D IC ATO R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

PIN 1

INDICATOR

AREA

Figure 57. 20-Lead, Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-20-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

Regulator Settings

Supervisory Settings

Temperature Range

Package Description

Package Option

ADP5043ACPZ-1-R7

VOUT1 = 1.5 V

WD1 tOUT = 1.6 sec

TJ = −40°C to +125°C

20-Lead LFCSP

CP-20-8

VOUT2 = 3.3 V

WD2 tOUT = 128 min

UVLO = 2.25 V

Reset tOUT = 200 ms

Sequencing: LDO, buck

POFF = 200 ms

VTH sensing = VOUT2, 2.93 V

ADP5043CP-1-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

2 Monitoring ambient temperature does not guarantee that the junction temperature (TJ) is within the specified temperature limits. See the Power Dissipation/Thermal

Considerations section for more information.

registered trademarks are the property of their respective owners.

D09682-0-9/19(C)

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