ADP5043ACPZ-1-R7 datasheet(7/30 Pages) AD

7 / 30 page

Data Sheet

ADP5043

Rev. C | Page 7 of 30

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

AVIN, VINx, VOUTx, ENx, MODE, MR, WDIx,

WMOD, WSTAT, nRSTO to GND

−0.3 V to +6 V

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

ESD Human Body Model

3000 V

ESD Charged Device Model

1500 V

ESD Machine Model

100 V

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination.

The ADP5043 can be damaged when the junction temperature

limits are exceeded. Monitoring ambient temperature does not

guarantee that the junction temperature is within the specified

temperature limits. In applications with high power dissipation

and poor thermal resistance, the maximum ambient temper-

ature may have to be derated. In applications with moderate

power dissipation and low PCB thermal resistance, the maximum

ambient temperature can exceed the maximum limit as long

as the junction temperature is within specification limits. The

junction temperature of the device is dependent on the ambient

temperature, the power dissipation of the device (PD), and the

junction-to-ambient thermal resistance of the package. Maxi-

mum junction temperature is calculated from the ambient

temperature and power dissipation using the formula

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on

the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending on

PCB material, layout, and environmental conditions. The specified

value of θJA is based on a four-layer, 4 inch × 3 inch, 2.5 oz

copper board, as per JEDEC standard. For additional

information, see the AN-772 Application Note, A Design and

Manufacturing Guide for the Lead Frame Chip Scale (LFCSP).

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 7. Thermal Resistance

Package Type

θJA

θJC

Unit

20-Lead, 0.5 mm pitch LFCSP

4.2

°C/W

ESD CAUTION

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