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AS3977

Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings“ may cause permanent damage to the device. These are stress ratings only.

Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” (see Table 3) is not

implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

-0.5

5.0

V

0

V

-40

40

mA

Norm: Jedec 17

ESD for Digital Pins

±4

kV

Norm MIL 883 E method 3015

(Human Body Model)

±200

V

Norm: EIJA IC-121

(Machine Model)

ESD for Analog Pins

±1.5

kV

Norm MIL 883 E method 3015

(Human Body Model)

±100

V

Norm: EIJA IC-121

(Machine Model)

ESD for RF Pins

±1.5

kV

Norm MIL 883 E method 3015

(Human Body Model)

±100

V

Norm: EIJA IC-121

(Machine Model)

Total power dissipation

(all supplies and outputs)

200

mW

-55

125

ºC

260

ºC

Norm: IPC/JEDEC J-STD-020C.

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020C “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

Humidity non-condensing

5

85

%