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STM32F373VC 数据表(PDF) 123 Page - STMicroelectronics |
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STM32F373VC 数据表(HTML) 123 Page - STMicroelectronics |
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123 / 137 page  DocID022691 Rev 7 123/137 STM32F373xx Package information 130 Figure 39. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat package recommended footprint 1. Dimensions are expressed in millimeters. Device marking for LQFP64 The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 40. LQFP64 marking example (package top view) 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. |
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