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ADE7933 数据表(PDF) 96 Page - Analog Devices |
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ADE7933 数据表(HTML) 96 Page - Analog Devices |
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96 / 125 page ![]() ADE7978/ADE7933/ADE7932/ADE7923 Data Sheet Rev. D | Page 96 of 125 Because a 4-layer PCB is used, a stitching capacitor is created between Layer 2 and Layer 3. Note that the first layer components placed on the isolated secondary side of the ADE7933 are surrounded by a ground plane connected to GNDISO. The second layer also has the same ground plane on the secondary side of the PCB. The third layer extends the ground of the primary side below the ADE7933 and the related circuitry, creating a stitching capacitor. This capacitance has an important role in reducing the emissions generated by the dc-to-dc converter of the ADE7933/ADE7932. Note that a distance of at least 8 mm is maintained on both sides between the input pins on the board and the ground planes. Layer 4 has the ground plane on the primary side of the ADE7933. Figure 124 shows the structure of the stitching capacitor created by a 4-layer PCB. The isolated ground plane of the second layer creates a capacitor (C23) with approximately an 1100 mm2 area and 100 pF capacitance, including the device, with the primary side ground plane placed on Layer 3. This capacitance plays an important role in reducing the emissions generated by the ADE7933/ADE7932 dc-to-dc converter. ADE7978 AND ADE7933/ADE7932 EVALUATION BOARD An evaluation board built upon the ADE7978 and ADE7933 chipset configuration is available (see the Ordering Guide). This board is used in conjunction with the system demonstration platform (EVAL-SDP-CB1Z). Order both the ADE7978/ ADE7933 evaluation board and the system demonstration platform to evaluate the ADE7978 and ADE7933. For more information, see the ADE7978 product page. ADE7978 DIE VERSION The version register identifies the version of the ADE7978 die. This 8-bit, read-only register is located at Address 0xE707. ADE7932/ADE7933 PRIMARY SIDE GROUND PLANE ON TOP LAYER ISOLATED SIDE GROUND PLANE ON TOP LAYER PRIMARY SIDE GROUND PLANE ON LAYER THREE ISOLATED SIDE GROUND PLANE ON LAYER TWO PRIMARY SIDE GROUND PLANE ON BOTTOM LAYER 20MILS = 0.508mm MIN C23 8mm 50MILS = 1.27mm 62MILS ± 10% = 1.574mm NOMINAL Figure 124. Stitching Capacitors Created by 4-Layer PCB |
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