数据搜索系统，热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

预览 PDF HTML

ADN8834ACPZ-R2 数据表(PDF) 6 Page - Analog Devices

部件名 ADN8834ACPZ-R2
功能描述  Ultracompact, 1.5 A Thermoelectric Cooler (TEC) Controller
PDF  27 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADN8834ACPZ-R2 数据表(HTML) 6 Page - Analog Devices

Back Button ADN8834ACPZ-R2 Datasheet HTML 2Page - Analog Devices ADN8834ACPZ-R2 Datasheet HTML 3Page - Analog Devices ADN8834ACPZ-R2 Datasheet HTML 4Page - Analog Devices ADN8834ACPZ-R2 Datasheet HTML 5Page - Analog Devices ADN8834ACPZ-R2 Datasheet HTML 6Page - Analog Devices ADN8834ACPZ-R2 Datasheet HTML 7Page - Analog Devices ADN8834ACPZ-R2 Datasheet HTML 8Page - Analog Devices ADN8834ACPZ-R2 Datasheet HTML 9Page - Analog Devices ADN8834ACPZ-R2 Datasheet HTML 10Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 6 / 27 page
background image
ADN8834
Data Sheet
Rev. B | Page 6 of 27
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
PVIN to PGNDL (WLCSP)
−0.3 V to +5.75 V
PVIN to PGNDS (WLCSP)
−0.3 V to +5.75 V
PVINL to PGNDL (LFCSP)
−0.3 V to +5.75 V
PVINS to PGNDS (LFCSP)
−0.3 V to +5.75 V
LDR to PGNDL (WLCSP)
−0.3 V to V
PVIN
LDR to PGNDL (LFCSP)
−0.3 V to V
PVINL
SW to PGNDS
−0.3 V to +5.75 V
SFB to AGND
−0.3 V to V
VDD
AGND to PGNDL
−0.3 V to +0.3 V
AGND to PGNDS
−0.3 V to +0.3 V
VLIM/SD to AGND
−0.3 V to V
VDD
ILIM to AGND
−0.3 V to V
VDD
VREF to AGND
−0.3 V to +3 V
VDD to AGND
−0.3 V to +5.75 V
IN1P to AGND
−0.3 V to V
VDD
IN1N to AGND
−0.3 V to V
VDD
OUT1 to AGND
−0.3 V to +5.75 V
IN2P to AGND
−0.3 V to V
VDD
IN2N to AGND
−0.3 V to V
VDD
OUT2 to AGND
−0.3 V to +5.75 V
EN/SY to AGND
−0.3 V to V
VDD
ITEC to AGND
−0.3 V to +5.75 V
VTEC to AGND
−0.3 V to +5.75 V
Maximum Current
VREF to AGND
20 mA
OUT1 to AGND
50 mA
OUT2 to AGND
50 mA
ITEC to AGND
50 mA
VTEC to AGND
50 mA
Junction Temperature
125°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature (Soldering, 10 sec)
260°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages, and is
based on a 4-layer standard JEDEC board.
Table 4.
Package Type
θ
JA
θ
JC
Unit
25-Ball WLCSP
48
0.6
°C/W
24-Lead LFCSP
37
1.65
°C/W
ESD CAUTION



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com