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ADPA7009-2ACEZ-R7 数据表(PDF) 1 Page - Analog Devices |
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ADPA7009-2ACEZ-R7 数据表(HTML) 1 Page - Analog Devices |
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1 / 24 page ![]() Data Sheet ADPA7009-2 20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier Rev. 0 DOCUMENT FEEDBACK TECHNICAL SUPPORT Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. FEATURES ► Integrated power-supply capacitors and bias inductors ► Integrated AC coupling capacitors ► Gain: 17.5 dB typical at 20 GHz to 35 GHz ► Input return loss: 14 dB typical at 20 GHz to 35 GHz ► Output return loss: 15 dB typical at 20 GHz to 35 GHz ► OP1dB: 28 dBm typical at 20 GHz to 35 GHz ► PSAT: 28.5 dBm typical at 20 GHz to 35 GHz ► OIP3: 34.5 dBm typical at 20 GHz to 35 GHz ► Noise figure: 7.5 dB typical at 20 GHz to 35 GHz ► 5 V supply voltage at 850 mA ► 50 Ω matched input and output ► 5.00 mm × 5.00 mm, 24-terminal chip array, small outline, no lead cavity [LGA_CAV] package APPLICATIONS ► Military and space ► Test instrumentation GENERAL DESCRIPTION The ADPA7009-2 is a gallium arsenide (GaAs), pseudomorphic high-electron-mobility transistor (pHEMT), monolithic microwave in- tegrated circuit (MMIC), 0.5 W power amplifier with an integrated temperature-compensated, on-chip power detector that operates between 20 GHz and 54 GHz. The amplifier provides a gain of 17.5 dB, an output power for 1 dB compression (OP1dB) of 28 dBm, and a typical output third-order intercept (OIP3) of 34.5 dBm at 20 GHz to 35 GHz. The ADPA7009-2 requires 850 mA from a 5 V supply voltage (VDDx). The RF input and outputs are internally matched and DC-blocked for ease of integration into higher level assemblies. Most of the typically required external passive components for operation (AC coupling capacitors and power supply decoupling capacitors) are integrated, which facilitates a small, compact printed circuit board (PCB) footprint. The ADPA7009-2 is available in a 5.00 mm × 5.00 mm, 24-terminal chip array, small outline, no lead cavity [LGA_CAV] package. FUNCTIONAL BLOCK DIAGRAM Figure 1. Functional Block Diagram |
类似零件编号 - ADPA7009-2ACEZ-R7 |
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类似说明 - ADPA7009-2ACEZ-R7 |
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