SAM9X60SIP datasheet(27/40 Pages) MICROCHIP

部件名	SAM9X60SIP

功能描述	SAM9X60 System-In-Package (SIP) MPU with up to 1 Gbit DDR2 SDRAM and up to 64 Mbits SDR-SDRAM

PDF	40 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

标志

27 / 40 page

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Terminal A1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Number of Terminals

Overall Height

Terminal Width

Overall Width

Overall Ball Pitch

Pitch

Standoff

Units

Dimension Limits

0.80 BSC

0.38

0.27

0.40

12.80 BSC

0.32

14.00 BSC

MILLIMETERS

MIN

NOM

233

0.48

1.20

0.37

MAX

Overall Length

Overall Ball Pitch

14.00 BSC

12.80 BSC

Microchip Technology Drawing C04-21501 Rev A Sheet 2 of 2

233-Ball Thin Fine Pitch Ball Grid Array (4FB) - 14x14 mm Body [TFBGA]

SAM9X60 SIP

Mechanical Characteristics

and its subsidiaries

Datasheet

DS60001580C-page 27

SAM9X60SIP 数据表(PDF) 27 Page - Microchip Technology

SAM9X60SIP 数据表(HTML) 27 Page - Microchip Technology

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