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SAM9X60SIP 数据表(PDF) 33 Page - Microchip Technology |
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SAM9X60SIP 数据表(HTML) 33 Page - Microchip Technology |
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33 / 40 page ![]() Table 9-7. Package Reference JEDEC Drawing Reference NA J-STD-609 Classification e8 Table 9-8. 196-Ball TFBGA Package Information Ball Land 0.4 ± 0.05 mm Nominal Ball Diameter 0.35 mm Solder Mask Opening 0.30 ± 0.03 mm Solder Mask Definition SMD Solder SAC105 SAM9X60 SIP Mechanical Characteristics © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS60001580C-page 33 |
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