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SAM9X60SIP 数据表(PDF) 28 Page - Microchip Technology |
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SAM9X60SIP 数据表(HTML) 28 Page - Microchip Technology |
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28 / 40 page ![]() © 2019 Microchip Technology Incorporated RECOMMENDED LAND PATTERN Dimension Limits Units C2 Contact Pad Spacing Contact Pitch MILLIMETERS 0.80 BSC MIN E MAX 12.80 5 3 . 0 1 X ) n n X ( h t d i W d a P t c a t n o C NOM C1 0 8 . 2 1 g n i c a p S d a P t c a t n o C BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M 1. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: E ØX SILK SCREEN U T R P N M L K J H G F E D C B A C2 C1 1 2 34 5 6 7 8 9 10 11 12 13 14 15 16 17 Microchip Technology Drawing C04-23501 Rev A 233-Ball Thin Fine Pitch Ball Grid Array (4FB) - 14x14 mm Body [TFBGA] SAM9X60 SIP Mechanical Characteristics © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS60001580C-page 28 |
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