– Thirteen FLEXCOMs (USART, SPI and TWI)

– One 12-channel 12-bit Analog-to-Digital Converter with 4/5 wires resistive touchscreen support

• Hardware Cryptography

– SHA (SHA1, SHA224, SHA256, SHA384, SHA512): compliant with FIPS PUB 180-2

– AES: 256-, 192-, 128-bit key algorithm, compliant with FIPS PUB 197

– TDES: two-key or three-key algorithms, compliant with FIPS PUB 46-3

– True Random Number Generator (TRNG) compliant with NIST Special Publication 800-22 Test Suite and

FIPS PUBs 140-2 and 140-3

• I/O Ports

– Four 32-bit Parallel Input/Output Controllers

– Up to 112 programmable I/O Lines multiplexed with up to three peripheral I/Os

– Input change interrupt capability on each I/O line, optional Schmitt trigger input

– Individually programmable open-drain, pull-up and pull-down resistor, synchronous output

– General-purpose analog and digital inputs tolerant to positive and negative current injection

• Package

– DDR2-SDRAM variant: 233-ball BGA, 14x14 mm², 0.8 mm pitch, optimized for standard class PCB layout

(down to 2 layers)

– SDR-SDRAM variant: 196-ball BGA, 11x11 mm², 0.65 mm pitch, optimized for standard class PCB layout

(down to 4 layers)

• Design for Low Electromagnetic Interference (EMI)

– Slew rate controlled I/Os

– DDR/SDR Phy with impedance-calibrated drivers

– Spread spectrum PLLs

– Careful BGA power/ground ball assignment to provide optimum decoupling capacitors placement

• Operating Conditions

– Ambient temperature range (TA): -40°C to +85°C

– Junction temperature range (TJ) : -40°C to +125°C

SAM9X60 SIP

© 2021 Microchip Technology Inc.

and its subsidiaries

Datasheet

DS60001580C-page 3