© 2019 Microchip Technology Incorporated

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

REF: Reference Dimension, usually without tolerance, for information purposes only, displayed in parentheses.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

1.

2.

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

Microchip Technology Drawing C04-21507 Rev A Sheet 2 of 2

196-Lead Thin Fine Pitch Ball Grid Array (4GB) - 11x11x1.2 mm Body [TFBGA]

Number of Terminals

Overall Height

Terminal Diameter

Overall Width

Overall Terminal Pitch

Mold Cap Height

Pitch

Standoff

Units

Dimension Limits

S

A

b

E1

A1

e

E

N

0.65 BSC

0.32

-

0.22

-

9.75 BSC

-

-

11.00 BSC

MILLIMETERS

MIN

NOM

196

0.42

1.20

0.32

MAX

Overall Length

Overall Terminal Pitch

D

D1

11.00 BSC

9.75 BSC

Substraight Thickness

M

0.53 REF

0.26 REF

SAM9X60 SIP

Mechanical Characteristics

© 2021 Microchip Technology Inc.

and its subsidiaries

Datasheet

DS60001580C-page 31