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SAM9X60SIP 数据表(PDF) 29 Page - Microchip Technology |
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SAM9X60SIP 数据表(HTML) 29 Page - Microchip Technology |
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29 / 40 page ![]() Table 9-1. 233-Ball TFBGA Package Characteristics Moisture Sensitivity Level 3 Table 9-2. Device and 233-Ball TFBGA Package Weight Device Weight (mg) SAM9X60D5M 394 SAM9X60D1G 399 Table 9-3. Package Reference JEDEC Drawing Reference NA J-STD-609 Classification e8 Table 9-4. 233-Ball TFBGA Package Information Ball Land 0.45 ± 0.05 mm Nominal Ball Diameter 0.4 mm Solder Mask Opening 0.35 ± 0.03 mm Solder Mask Definition SMD Solder SAC105 SAM9X60 SIP Mechanical Characteristics © 2021 Microchip Technology Inc. and its subsidiaries Datasheet DS60001580C-page 29 |
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