SAM9X60SIP datasheet(32/40 Pages) MICROCHIP

部件名	SAM9X60SIP

功能描述	SAM9X60 System-In-Package (SIP) MPU with up to 1 Gbit DDR2 SDRAM and up to 64 Mbits SDR-SDRAM

PDF	40 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

标志

32 / 40 page

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.65 BSC

MIN

MAX

9.75

)

(

NOM

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØX

SILK SCREEN

Microchip Technology Drawing C04-23507 Rev B

196-Lead Thin Fine Pitch Ball Grid Array (4GB) - 11x11x1.2 mm Body [TFBGA]

1234

678

9 10 11 12 13 14 15 16

Space Between Contact Pads

0.20

Table 9-5. 196-Ball TFBGA Package Characteristics

Moisture Sensitivity Level

Table 9-6. Device and 196-Ball TFBGA Package Weight

Device

Weight (mg)

SAM9X60D6K

251

SAM9X60 SIP

Mechanical Characteristics

and its subsidiaries

Datasheet

DS60001580C-page 32

SAM9X60SIP 数据表(PDF) 32 Page - Microchip Technology

SAM9X60SIP 数据表(HTML) 32 Page - Microchip Technology

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