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RSC-4128
Data Sheet
46
P/N 80-0206-R
© 2006 Sensory Inc.
RSC-4128 Die Bonding Pad Locations
PAD #
PADNAME X (um) Y (um)
PAD #
PADNAME X (um) Y (um)
PAD #
PADNAME X (um) Y (um)
PAD #
PADNAME X (um) Y (um)
1
P0.0
95
4564
30
DACOUT
447
95
53
PLLEN
2965
368
82
P0.6
2694
4880
2
D7
95
4412
31
AVSS
542
95
54
A17
2965
516
83
A6
2599
4880
3
D6
95
4260
32
VCM
637
95
55
P1.7
2965
665
84
P0.5
2504
4880
4
PDN
95
4107
33
MICIN2
732
95
56
A16
2965
813
85
A5
2409
4880
5
D5
95
3955
34
MICIN1
827
95
57
P1.6
2965
961
86
P0.4
2314
4880
6
D4
95
3803
35
AMPCOM
922
95
58
GND
2965
1110
87
A4
2219
4880
7
GND
95
3651
36
VREF
1017
95
59
GND
2965
1291
88
GND
2124
4880
8
GND
95
3498
37
AVDD
1112
95
60
VDD
2965
1446
89
GND
2029
4880
9
XO1
95
3346
38
P2.4
1364
95
61
VDD
2965
1681
90
PWM0
1792
4880
10
XI1
95
3251
39
P2.3
1459
95
62
A15
2965
1831
91
PWM1
1366
4880
11
VDD
95
3063
40
P2.2
1554
95
63
P1.5
2965
1972
92
VDD
1128
4880
12
VDD
95
2858
41
GND
1649
95
64
A14
2965
2104
93
VDD
1033
4880
13
-XM
95
2729
42
P2.1
1744
95
65
P1.4
2965
2237
94
A3
938
4880
14
XO2
95
2605
43
P2.0
1839
95
66
A13
2965
2366
95
P0.3
843
4880
15
XI2
95
2510
44
GND
1934
95
67
P1.3
2965
2481
96
A2
748
4880
16
D3
95
2376
45
VDD
2029
95
68
A12
2965
2596
97
P0.2
653
4880
17
D2
95
2238
46
-RDF
2124
95
69
P1.2
2965
2708
98
A1
558
4880
18
P2.7
95
2095
47
-WRD
2219
95
70
A11
2965
2817
99
P0.1
463
4880
19
D1
95
1943
48
-RDR
2314
95
71
P1.1
2965
3061
100
A0
368
4880
20
D0
95
1790
49
-WRC
2409
95
72
A10
2965
3194
21
GND
95
1667
50
A19
2504
95
73
GND
2965
3358
22
GND
95
1434
51
A18
2599
95
74
GND
2965
3513
23
VDD
95
1282
52
reserved
2694
95
75
VDD
2965
3678
24
VDD
95
1129
76
VDD
2965
3827
25
P2.6
95
964
77
A9
2965
3975
26
reserved
95
825
78
P1.0
2965
4123
27
P2.5
95
672
79
A8
2965
4272
28
reserved
95
520
80
A7
2965
4420
29
-RESET
95
368
81
P0.7
2965
4568
Notes:
1. Coordinates are in microns (um), rounded to nearest um.
2. Coordinates are of the center of the bonding pad opening (70um).
3. Coordinate (0,0) is the lower left corner of the die.
4. Die size with scribe and seal ring is 3060 um x 4975 um.
5. No external die substrate tie is required. However, a substrate tie to ground is preferred.
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