 |
数据搜索系统，热门电子元器件搜索 |
|
|
数据搜索系统，热门电子元器件搜索 |
|
PCF2103EU/2/F2 数据表(PDF) 53 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
PCF2103EU/2/F2 数据表(HTML) 53 Page - NXP Semiconductors |
|
|
53 / 56 page  1998 May 11 53 Philips Semiconductors Product specification LCD controllers/drivers PCF2103 family C4 76 −986 1414 C3 77 −1076 1414 C3 (dummy) 78 −1166 1414 C2 (dummy) 79 −1344 1303 C2 80 −1344 1213 C1 81 −1344 1123 R8 82 −1344 1033 R7 83 −1344 943 R6 84 −1344 853 R5 85 −1344 763 R4 86 −1344 673 R3 87 −1344 583 R2 88 −1344 493 R1 89 −1344 403 R17 90 −1344 313 SCL 91 −1344 131 SDA 92 −1344 −9 E93 −1344 −195 RS 94 −1344 −289 RW 95 −1344 −382 DB7 96 −1344 −476 DB6 97 −1344 −572 DB5 98 −1344 −668 DB4 99 −1344 −765 DB3 100 −1344 −861 DB2 101 −1344 −957 DB1 102 −1344 −1054 DB0 103 −1344 −1150 DB0 (dummy) 104 −1344 −1240 Rec. Pat. C1 1335 −1405 Rec. Pat. C2 −1335 1405 Rec. Pat. F −1340 −1397 SYMBOL PAD X Y Table 19 Bump specifications PARAMETER SPECIFICATION UNIT Bump variant N − Type galvanic; pure aurum − Bump width 60 ±6 µm Bump length 90 ±6 µm Bump height 17.5 ±5 µm Height difference in one die <2 µm Convex deformation <5 µm Pad size; aluminium 80 × 100 µm Passivation opening CBB 46 × 76 µm Wafer thickness 380 ±25 µm Minimum pitch 90 µm |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Chinese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
