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AMC7832IPAPR 数据表(PDF) 72 Page - Texas Instruments

部件名 AMC7832IPAPR
功能描述  AMC7832 12-Bit Analog Monitor and Control Solution with Multi-Channel ADC, Bipolar DACs, Temperature Sensor and GPIO Ports
PDF  74 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

AMC7832IPAPR 数据表(HTML) 72 Page - Texas Instruments

Back Button AMC7832IPAPR Datasheet HTML 66Page - Texas Instruments AMC7832IPAPR Datasheet HTML 67Page - Texas Instruments AMC7832IPAPR Datasheet HTML 68Page - Texas Instruments AMC7832IPAPR Datasheet HTML 69Page - Texas Instruments AMC7832IPAPR Datasheet HTML 70Page - Texas Instruments AMC7832IPAPR Datasheet HTML 71Page - Texas Instruments AMC7832IPAPR Datasheet HTML 72Page - Texas Instruments AMC7832IPAPR Datasheet HTML 73Page - Texas Instruments AMC7832IPAPR Datasheet HTML 74Page - Texas Instruments  
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EXAMPLE BOARD LAYOUT
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
(11.4)
(11.4)
60X (0.5)
64X (1.5)
64X (0.3)
(
0.2) TYP
VIA
(
7)
(
8)
NOTE 8
(R0.05)
TYP
(1.3 TYP)
(1.3 TYP)
PowerPAD
TQFP - 1.2 mm max height
PAP0064G
PLASTIC QUAD FLATPACK
4218924/A 01/2022
TM
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
SYMM
64
49
17
32
33
48
1
16
SOLDER MASK
DEFINED PAD
METAL COVERED
BY SOLDER MASK
65
SEE DETAILS
SYMM
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL



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