XIO2001IPNP datasheet(131/145 Pages) TI2

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10.2 Documentation Support

10.2.1 Related Documents

• PCI Express to PCI/PCI-X Bridge Specification, Revision 1.0

• PCI Express Base Specification, Revision 2.0

• PCI Express Card Electromechanical Specification, Revision 2.0

• PCI Local Bus Specification, Revision 2.3

• PCI-to-PCI Bridge Architecture Specification, Revision 1.2

• PCI Bus Power Management Interface Specification, Revision 1.2

• PCI Mobile Design Guide, Revision 1.1

• Serialized IRQ Support for PCI Systems, Revision 6.0

10.2.1.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

PCI Express™ is a trademark of PCI-SIG.

PowerPad™ and PowerPAD™ are trademarks of Texas Instruments.

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com

XIO2001

SCPS212J – MAY 2009 – REVISED JANUARY 2021

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