STM32F427AI datasheet(215/240 Pages) STMICROELECTRONICS

215 / 240 page

DS9405 Rev 12

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STM32F427xx STM32F429xx

Package information

231

Notes:

Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.

The Top package body size may be smaller than the bottom package size by as much

as 0.15 mm.

Datums A-B and D to be determined at datum plane H.

To be determined at seating datum plane C.

Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash

or protrusions is “0.25 mm” per side. D1 and E1 are Maximum plastic body size

dimensions including mold mismatch.

Details of pin 1 identifier are optional but must be located within the zone indicated.

All Dimensions are in millimeters.

No intrusion allowed inwards the leads.

Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall

not cause the lead width to exceed the maximum “b” dimension by more than 0.08 mm.

Dambar cannot be located on the lower radius or the foot. Minimum space between

protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.

10. Exact shape of each corner is optional.

11. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm

from the lead tip.

12. A1 is defined as the distance from the seating plane to the lowest point on the package

body.

13. “N” is the number of terminal positions for the specified body size.

14. Values in inches are converted from mm and rounded to 4 decimal digits.

15. Drawing is not to scale.

Figure 88. LQFP208 - footprint example

1. Dimensions are expressed in millimeters.

UH_LQFP208_FP_V3

30.7

25.8

1.2

104

105

208

0.50

157

156

0.30

1.25

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